Thin small outline package
This article needs additional citations for verification. (July 2007) |
_BW.svg){kind=link}
Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1 mm) and have tight lead spacing (as low as 0.5 mm).
They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and EEPROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications.
TSOP is the smallest leaded form factor for flash memory.[1]
History
[edit | edit source]The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card.[2]
Physical properties
[edit | edit source]
_-_board_-_Winbond_W982516BH75L-2986.jpg){kind=link}
TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. [3]
Type I
[edit | edit source]| Part number | Pins | Body width (mm) | Body length (mm) | Lead pitch (mm) |
|---|---|---|---|---|
| TSOP28 | 28 | 8.1 | 11.8 | 0.55 |
| TSOP28/32 | 28/32 | 8 | 18.4 | 0.5 |
| TSOP40 | 40 | 10 | 18.4 | 0.5 |
| TSOP48 | 48 | 12 | 18.4 | 0.5 |
| TSOP56 | 56 | 14 | 18.4 | 0.5 |
Type II
[edit | edit source]| Part number | Pins | Body width (mm) | Body length (mm) | Lead pitch (mm) |
|---|---|---|---|---|
| TSOP6 (SOT457)[4] | 6 | 1.5 | 2.9 | 0.95 |
| TSOP20/24/26 | 20/24/26 | 7.6 | 17.14 | 1.27 |
| TSOP24/28 | 24/28 | 10.16 | 18.41 | 1.27 |
| TSOP32 | 32 | 10.16 | 20.95 | 1.27 |
| TSOP40/44 | 40/44 | 10.16 | 18.42 | 0.8 |
| TSOP50 | 50 | 10.16 | 20.95 | 0.8 |
| TSOP54 | 54 | 10.16 | 22.22 | 0.8 |
| TSOP66 | 66 | 10.16 | 22.22 | 0.65 |
HTSOP
[edit | edit source]HTSOP (Heatsink TSOP) is a variant of TSOP with an exposed pad on the bottom side.[citation needed] The pad is soldered to the PCB to transfer heat from the package to the PCB.
Similar packages
[edit | edit source]There are a variety of small form-factor IC carrier available other than TSOPs
- Small-outline integrated circuit (SOIC)
- Plastic small-outline package (PSOP)
- Shrink small-outline package (SSOP)
- Thin-shrink small outline package (TSSOP)
See also
[edit | edit source]- Integrated circuit
- Chip carrier Chip packaging and package types list
References
[edit | edit source]- ^ Lua error in Module:Citation/CS1/Configuration at line 2172: attempt to index field '?' (a nil value).
- ^ Texas Instruments. "Recent Advancements in Bus-Interface Packaging and Processing". 1997. p. 2
- ^ SiliconFarEast: "TSOP - Thin Small Outline Package"
- ^ Lua error in Module:Citation/CS1/Configuration at line 2172: attempt to index field '?' (a nil value).
