Mini Small Outline Package
The Mini Small Outline Package (MSOP) is a miniaturized version of the small outline integrated circuit packaging format for integrated circuits.
Application
[edit | edit source]Many integrated circuits are available in the MSOP form factor. They are suited for space-limited applications requiring 1 mm or less mounted height and are commonly used in disk drives, video/audio and consumer electronics.[1]
Physical properties
[edit | edit source]The size of the Mini Small Outline Package is only 3mm × 3mm for the 8 and 10 pin versions[1] and 3mm × 4mm for the 12 and 16 pin version.[2][3] The small package offers a small footprint, short wires for improved electrical connections, and good moisture reliability.[1] Some versions have an exposed pad on the bottom side. The exposed pad will be soldered on the PCB to transfer heat from the package to the PCB.[2][1]
| Package | Pins | Body width (mm) | Body length (mm) | Lead pitch (mm) |
|---|---|---|---|---|
| MSOP8 | 8 | 3 | 3 | 0.65 |
| MSOP10 | 10 | 3 | 3 | 0.5 |
| MSOP12 | 12 | 3 | 4 | 0.65 |
| MSOP16 | 16 | 3 | 4 | 0.5 |
Synonyms
[edit | edit source]- μMAX or micro max - Maxim name for the MSOP package.[4][2]
- μMAX-EP or micro max exposed pad - Maxim name for the MSOP package with exposed pad.[2][4]
- MSE - Linear Technology name for the MSOP package with exposed pad.[2]
See also
[edit | edit source]References
[edit | edit source]
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