File:FOWLP type.png

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Original file (1,874 × 1,412 pixels, file size: 181 KB, MIME type: image/png)

Summary

Description
中文(中国大陆):​扇出晶圆级封装工艺分类:面朝下,先芯片;面朝上,先芯片;面朝下,后芯片;
Date
Source Own work
Author 思考的苇丛

Licensing

I, the copyright holder of this work, hereby publish it under the following license:
w:en:Creative Commons
attribution
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Under the following conditions:
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Captions

Fan-out wafel level package type

Items portrayed in this file

depicts

25 March 2024

image/png

184,942 byte

1,412 pixel

1,874 pixel

61a3e8b6015994b40c50405963a61fe6b8a59e94

File history

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Date/TimeThumbnailDimensionsUserComment
current13:36, 25 March 2024No thumbnail1,874 × 1,412 (181 KB)wikimediacommons>思考的苇丛Uploaded own work with UploadWizard

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