File:FOWLP type.png
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Size of this preview: 796 × 600 pixels. Other resolutions: 319 × 240 pixels | 637 × 480 pixels | 1,019 × 768 pixels | 1,280 × 964 pixels | 1,874 × 1,412 pixels.
Original file (1,874 × 1,412 pixels, file size: 181 KB, MIME type: image/png)
Summary
| Description |
中文（中国大陆）：扇出晶圆级封装工艺分类：面朝下，先芯片；面朝上，先芯片；面朝下，后芯片； |
| Date | |
| Source | Own work |
| Author | 思考的苇丛 |
Licensing
I, the copyright holder of this work, hereby publish it under the following license:
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 13:36, 25 March 2024 | No thumbnail | 1,874 × 1,412 (181 KB) | wikimediacommons>思考的苇丛 | Uploaded own work with UploadWizard |
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